| Date Listed |
February 7, 2012 |
| Address: |
1802B,Block C6,HengFeng Ind.Hezhou,Xixiang,BaoAn,Shenzhen , City, State, 518002, China
View Map
|
| Price |
Please Contact |
Manufacturing Services: Komplette Montage des Produktes (Box Build)
Procurement: Schlüsselfertige und Consignment
Board Assembly: Surface Mount, Through Hole, Auto Insertion und Manuelle Zufuhr.
Assembly-Funktionen: Ball Grid Array (BGA), Multi-Chip Module (MCM), Flip Chip, Chip-on-Board (COB), Tape Automated Bonding (TAB), Wire Bonding und Mil-spec.
Chip Size Platzierung: 1608, 1005, 0603, 0402 und 0201
Printed Circuit Board Gr??e Capabilities: Kleinste PCB Dimension 2 "von 2" und die gr??te PCB Dimension 15 "durch 20".
Cleaning-Funktionen: W?ssrige, No-Clean and Alternate Solvent.
Testm?glichkeiten: In Circuit, Functional, Burn-In, Automatic Test Equipment (ATE) Design und X-ray.
E-mail: info@szckt.cn
MSN: szcktbluce@hotmail.com
Skype: brucelu805
http://www.szckt.cn
http://cirket.manufacturer.globalsources.com
Visits : 24
|
|
